NEW Course: Semiconductor Materials and Processing
Learn the use and science fundamentals behind the materials critical to microelectronic devices and device packaging, such as silicon, germanium, alumina, silver, copper and polymers.
Highlighted within the course will be the chemistry, sourcing, processing, testing and assembly of these materials as semiconductor devices and the protective packaging that permits these microdevices to be interconnected within larger electronic systems.
At course completion, students will possess an understanding of the functions, design considerations, protective packaging, assembly and system integration of microelectronic devices.
- Introduction of state-of-the-art technology
- San Diego regional emphasis relating to Telecom and Medical Electronics
- Industry guest speakers with real-world anecdotal challenges and solutions
- Opportunity to compile engineering practical tools and guidelines that can be used in professional settings
Students who have successfully completed this course will be able to:
- Identify materials and their chemical properties necessary for effective semiconductor package design
- Analyze the benefits and drawbacks associated with various assembly and manufacturing strategies
- Develop research approaches to assessing materials principles and summarize them as useful tools
- Create and document effective materials property tools
- Apply these tools for device packaging design
Course Number: EE-40176
Credit: 3.00 unit(s)