Skip to Content

Timothy LeClair

Tim LeClair has more than thirty years of experience in supporting semiconductor device package design, process development, production ramping and component/device reliability in a wide range of industries including biotech, cellphone handset, avionics, hi-reliability military and consumer electronics. Specifically, he has created a wide range of package strategies and solutions for cellphone handset components for Motorola, laser scannable modules holding microchips for DNA hybridization for Nanogen, and acoustic sensor MEMS packaging for gas flow metering, copier paper gauging, resonator (FBAR) MEMS and Front End (RF) Modules for Avago.

LeClair, Timothy

Related Links